Properties of electrodeposited Fe-Cu films grown on ITO coated glass substrates at different electrolyte temperatures
Identifieur interne : 000648 ( Main/Repository ); précédent : 000647; suivant : 000649Properties of electrodeposited Fe-Cu films grown on ITO coated glass substrates at different electrolyte temperatures
Auteurs : RBID : Pascal:13-0248479Descripteurs français
- Pascal (Inist)
- Dépôt électrolytique, Addition étain, Revêtement, Electrolyte, Analyse structurale, Diffraction RX, Phase alpha, Spectrométrie dispersive, Morphologie surface, Structure surface, Microscopie électronique balayage, Contrainte résiduelle, Connexion par billes, Cuivre, Oxyde d'indium, Matériau revêtu, Verre, Réseau cubique centré, Matériau cristallin, Couche contrainte, Fabrication microélectronique, Matériau dopé, Assemblage circuit intégré, 8105K, 0779, 8540H, ITO.
- Wicri :
English descriptors
- KwdEn :
- Alpha phase, BCC lattices, Coated material, Coatings, Copper, Crystalline material, Dispersive spectrometry, Doped materials, Electrodeposition, Electrolyte, Flip chip bonding, Glass, Indium oxide, Integrated circuit bonding, Microelectronic fabrication, Residual stress, Scanning electron microscopy, Strained layer, Structural analysis, Surface morphology, Surface structure, Tin addition, X ray diffraction.
Abstract
In this study, effect of electrolyte temperature on structural and morphological properties of Fe-Cu films electrodeposited on ITO coated glass substrates has been investigated. Structural analysis carried out by using X-ray diffraction indicated that the films consist of a mixture of face-centered cubic (FCC) Cu and body centered cubic (BCC) α-Fe phases. It was found that the crystalline size of both Fe and Cu increases with increasing electrolyte temperature. Compositional analysis performed using energy dispersive X-ray spectroscopy showed that the Cu content within the films enhances with increasing electrolyte temperature. The surface morphology of Fe-Cu films was studied using a scanning electron microscopy (SEM). SEM results indicated that the surface morphology of Fe-Cu films significantly depends on the electrolyte temperature. The investigation of the residual stress in the films indicated that the residual stress for the FCC Cu is tensile in all films regardless of electrolyte temperature, whereas, for the BCC Fe, it depends on the electrolyte temperature. Correlation between the surface morphology and the residual stress is discussed in terms of the obtained results.
Links toward previous steps (curation, corpus...)
- to stream Main, to step Corpus: 000A06
Links to Exploration step
Pascal:13-0248479Le document en format XML
<record><TEI><teiHeader><fileDesc><titleStmt><title xml:lang="en" level="a">Properties of electrodeposited Fe-Cu films grown on ITO coated glass substrates at different electrolyte temperatures</title><author><name sortKey="Sarac, Umut" uniqKey="Sarac U">Umut Sarac</name><affiliation wicri:level="1"><inist:fA14 i1="01"><s1>Department of Elementary Education, Bartin University</s1><s2>Bartin 74100</s2><s3>TUR</s3><sZ>1 aut.</sZ></inist:fA14><country>Turquie</country><wicri:noRegion>Bartin 74100</wicri:noRegion></affiliation></author><author><name sortKey="Celalettin Baykul, M" uniqKey="Celalettin Baykul M">M. Celalettin Baykul</name><affiliation wicri:level="1"><inist:fA14 i1="02"><s1>Department of Physics, Eskişehir Osmangazi University</s1><s2>Eskisehir 26480</s2><s3>TUR</s3><sZ>2 aut.</sZ></inist:fA14><country>Turquie</country><wicri:noRegion>Eskisehir 26480</wicri:noRegion></affiliation></author></titleStmt><publicationStmt><idno type="inist">13-0248479</idno><date when="2013">2013</date><idno type="stanalyst">PASCAL 13-0248479 INIST</idno><idno type="RBID">Pascal:13-0248479</idno><idno type="wicri:Area/Main/Corpus">000A06</idno><idno type="wicri:Area/Main/Repository">000648</idno></publicationStmt><seriesStmt><idno type="ISSN">0957-4522</idno><title level="j" type="abbreviated">J. mater. sci., Mater. electron.</title><title level="j" type="main">Journal of materials science. Materials in electronics</title></seriesStmt></fileDesc><profileDesc><textClass><keywords scheme="KwdEn" xml:lang="en"><term>Alpha phase</term><term>BCC lattices</term><term>Coated material</term><term>Coatings</term><term>Copper</term><term>Crystalline material</term><term>Dispersive spectrometry</term><term>Doped materials</term><term>Electrodeposition</term><term>Electrolyte</term><term>Flip chip bonding</term><term>Glass</term><term>Indium oxide</term><term>Integrated circuit bonding</term><term>Microelectronic fabrication</term><term>Residual stress</term><term>Scanning electron microscopy</term><term>Strained layer</term><term>Structural analysis</term><term>Surface morphology</term><term>Surface structure</term><term>Tin addition</term><term>X ray diffraction</term></keywords><keywords scheme="Pascal" xml:lang="fr"><term>Dépôt électrolytique</term><term>Addition étain</term><term>Revêtement</term><term>Electrolyte</term><term>Analyse structurale</term><term>Diffraction RX</term><term>Phase alpha</term><term>Spectrométrie dispersive</term><term>Morphologie surface</term><term>Structure surface</term><term>Microscopie électronique balayage</term><term>Contrainte résiduelle</term><term>Connexion par billes</term><term>Cuivre</term><term>Oxyde d'indium</term><term>Matériau revêtu</term><term>Verre</term><term>Réseau cubique centré</term><term>Matériau cristallin</term><term>Couche contrainte</term><term>Fabrication microélectronique</term><term>Matériau dopé</term><term>Assemblage circuit intégré</term><term>8105K</term><term>0779</term><term>8540H</term><term>ITO</term></keywords><keywords scheme="Wicri" type="concept" xml:lang="fr"><term>Cuivre</term><term>Verre</term></keywords></textClass></profileDesc></teiHeader><front><div type="abstract" xml:lang="en">In this study, effect of electrolyte temperature on structural and morphological properties of Fe-Cu films electrodeposited on ITO coated glass substrates has been investigated. Structural analysis carried out by using X-ray diffraction indicated that the films consist of a mixture of face-centered cubic (FCC) Cu and body centered cubic (BCC) α-Fe phases. It was found that the crystalline size of both Fe and Cu increases with increasing electrolyte temperature. Compositional analysis performed using energy dispersive X-ray spectroscopy showed that the Cu content within the films enhances with increasing electrolyte temperature. The surface morphology of Fe-Cu films was studied using a scanning electron microscopy (SEM). SEM results indicated that the surface morphology of Fe-Cu films significantly depends on the electrolyte temperature. The investigation of the residual stress in the films indicated that the residual stress for the FCC Cu is tensile in all films regardless of electrolyte temperature, whereas, for the BCC Fe, it depends on the electrolyte temperature. Correlation between the surface morphology and the residual stress is discussed in terms of the obtained results.</div></front></TEI><inist><standard h6="B"><pA><fA01 i1="01" i2="1"><s0>0957-4522</s0></fA01><fA03 i2="1"><s0>J. mater. sci., Mater. electron.</s0></fA03><fA05><s2>24</s2></fA05><fA06><s2>3</s2></fA06><fA08 i1="01" i2="1" l="ENG"><s1>Properties of electrodeposited Fe-Cu films grown on ITO coated glass substrates at different electrolyte temperatures</s1></fA08><fA11 i1="01" i2="1"><s1>SARAC (Umut)</s1></fA11><fA11 i1="02" i2="1"><s1>CELALETTIN BAYKUL (M.)</s1></fA11><fA14 i1="01"><s1>Department of Elementary Education, Bartin University</s1><s2>Bartin 74100</s2><s3>TUR</s3><sZ>1 aut.</sZ></fA14><fA14 i1="02"><s1>Department of Physics, Eskişehir Osmangazi University</s1><s2>Eskisehir 26480</s2><s3>TUR</s3><sZ>2 aut.</sZ></fA14><fA20><s1>952-957</s1></fA20><fA21><s1>2013</s1></fA21><fA23 i1="01"><s0>ENG</s0></fA23><fA43 i1="01"><s1>INIST</s1><s2>22352</s2><s5>354000503651710180</s5></fA43><fA44><s0>0000</s0><s1>© 2013 INIST-CNRS. All rights reserved.</s1></fA44><fA45><s0>47 ref.</s0></fA45><fA47 i1="01" i2="1"><s0>13-0248479</s0></fA47><fA60><s1>P</s1></fA60><fA61><s0>A</s0></fA61><fA64 i1="01" i2="1"><s0>Journal of materials science. Materials in electronics</s0></fA64><fA66 i1="01"><s0>USA</s0></fA66><fC01 i1="01" l="ENG"><s0>In this study, effect of electrolyte temperature on structural and morphological properties of Fe-Cu films electrodeposited on ITO coated glass substrates has been investigated. Structural analysis carried out by using X-ray diffraction indicated that the films consist of a mixture of face-centered cubic (FCC) Cu and body centered cubic (BCC) α-Fe phases. It was found that the crystalline size of both Fe and Cu increases with increasing electrolyte temperature. Compositional analysis performed using energy dispersive X-ray spectroscopy showed that the Cu content within the films enhances with increasing electrolyte temperature. The surface morphology of Fe-Cu films was studied using a scanning electron microscopy (SEM). SEM results indicated that the surface morphology of Fe-Cu films significantly depends on the electrolyte temperature. The investigation of the residual stress in the films indicated that the residual stress for the FCC Cu is tensile in all films regardless of electrolyte temperature, whereas, for the BCC Fe, it depends on the electrolyte temperature. Correlation between the surface morphology and the residual stress is discussed in terms of the obtained results.</s0></fC01><fC02 i1="01" i2="X"><s0>001D03C</s0></fC02><fC02 i1="02" i2="3"><s0>001B80A15P</s0></fC02><fC02 i1="03" i2="X"><s0>001D11C06</s0></fC02><fC02 i1="04" i2="3"><s0>001B60H35B</s0></fC02><fC02 i1="05" i2="X"><s0>240</s0></fC02><fC03 i1="01" i2="X" l="FRE"><s0>Dépôt électrolytique</s0><s5>01</s5></fC03><fC03 i1="01" i2="X" l="ENG"><s0>Electrodeposition</s0><s5>01</s5></fC03><fC03 i1="01" i2="X" l="GER"><s0>Elektroplattieren</s0><s5>01</s5></fC03><fC03 i1="01" i2="X" l="SPA"><s0>Depósito electrolítico</s0><s5>01</s5></fC03><fC03 i1="02" i2="X" l="FRE"><s0>Addition étain</s0><s5>02</s5></fC03><fC03 i1="02" i2="X" l="ENG"><s0>Tin addition</s0><s5>02</s5></fC03><fC03 i1="02" i2="X" l="GER"><s0>Zinnzusatz</s0><s5>02</s5></fC03><fC03 i1="02" i2="X" l="SPA"><s0>Adición estaño</s0><s5>02</s5></fC03><fC03 i1="03" i2="X" l="FRE"><s0>Revêtement</s0><s5>03</s5></fC03><fC03 i1="03" i2="X" l="ENG"><s0>Coatings</s0><s5>03</s5></fC03><fC03 i1="03" i2="X" l="GER"><s0>Ueberzug</s0><s5>03</s5></fC03><fC03 i1="03" i2="X" l="SPA"><s0>Revestimiento</s0><s5>03</s5></fC03><fC03 i1="04" i2="X" l="FRE"><s0>Electrolyte</s0><s5>04</s5></fC03><fC03 i1="04" i2="X" l="ENG"><s0>Electrolyte</s0><s5>04</s5></fC03><fC03 i1="04" i2="X" l="GER"><s0>Elektrolyt</s0><s5>04</s5></fC03><fC03 i1="04" i2="X" l="SPA"><s0>Electrólito</s0><s5>04</s5></fC03><fC03 i1="05" i2="X" l="FRE"><s0>Analyse structurale</s0><s5>05</s5></fC03><fC03 i1="05" i2="X" l="ENG"><s0>Structural analysis</s0><s5>05</s5></fC03><fC03 i1="05" i2="X" l="SPA"><s0>Análisis estructural</s0><s5>05</s5></fC03><fC03 i1="06" i2="X" l="FRE"><s0>Diffraction RX</s0><s5>06</s5></fC03><fC03 i1="06" i2="X" l="ENG"><s0>X ray diffraction</s0><s5>06</s5></fC03><fC03 i1="06" i2="X" l="GER"><s0>Roentgenbeugung</s0><s5>06</s5></fC03><fC03 i1="06" i2="X" l="SPA"><s0>Difracción RX</s0><s5>06</s5></fC03><fC03 i1="07" i2="X" l="FRE"><s0>Phase alpha</s0><s5>07</s5></fC03><fC03 i1="07" i2="X" l="ENG"><s0>Alpha phase</s0><s5>07</s5></fC03><fC03 i1="07" i2="X" l="GER"><s0>Alpha Phase</s0><s5>07</s5></fC03><fC03 i1="07" i2="X" l="SPA"><s0>Fase alfa</s0><s5>07</s5></fC03><fC03 i1="08" i2="X" l="FRE"><s0>Spectrométrie dispersive</s0><s5>08</s5></fC03><fC03 i1="08" i2="X" l="ENG"><s0>Dispersive spectrometry</s0><s5>08</s5></fC03><fC03 i1="08" i2="X" l="SPA"><s0>Espectrometría dispersiva</s0><s5>08</s5></fC03><fC03 i1="09" i2="3" l="FRE"><s0>Morphologie surface</s0><s5>09</s5></fC03><fC03 i1="09" i2="3" l="ENG"><s0>Surface morphology</s0><s5>09</s5></fC03><fC03 i1="10" i2="X" l="FRE"><s0>Structure surface</s0><s5>10</s5></fC03><fC03 i1="10" i2="X" l="ENG"><s0>Surface structure</s0><s5>10</s5></fC03><fC03 i1="10" i2="X" l="GER"><s0>Oberflaechenbeschaffenheit</s0><s5>10</s5></fC03><fC03 i1="10" i2="X" l="SPA"><s0>Estructura superficie</s0><s5>10</s5></fC03><fC03 i1="11" i2="X" l="FRE"><s0>Microscopie électronique balayage</s0><s5>11</s5></fC03><fC03 i1="11" i2="X" l="ENG"><s0>Scanning electron microscopy</s0><s5>11</s5></fC03><fC03 i1="11" i2="X" l="GER"><s0>Rasterelektronenmikroskopie</s0><s5>11</s5></fC03><fC03 i1="11" i2="X" l="SPA"><s0>Microscopía electrónica barrido</s0><s5>11</s5></fC03><fC03 i1="12" i2="X" l="FRE"><s0>Contrainte résiduelle</s0><s5>12</s5></fC03><fC03 i1="12" i2="X" l="ENG"><s0>Residual stress</s0><s5>12</s5></fC03><fC03 i1="12" i2="X" l="GER"><s0>Eigenspannung</s0><s5>12</s5></fC03><fC03 i1="12" i2="X" l="SPA"><s0>Tensión residual</s0><s5>12</s5></fC03><fC03 i1="13" i2="X" l="FRE"><s0>Connexion par billes</s0><s5>13</s5></fC03><fC03 i1="13" i2="X" l="ENG"><s0>Flip chip bonding</s0><s5>13</s5></fC03><fC03 i1="13" i2="X" l="SPA"><s0>Conexión espesada</s0><s5>13</s5></fC03><fC03 i1="14" i2="X" l="FRE"><s0>Cuivre</s0><s2>NC</s2><s5>22</s5></fC03><fC03 i1="14" i2="X" l="ENG"><s0>Copper</s0><s2>NC</s2><s5>22</s5></fC03><fC03 i1="14" i2="X" l="GER"><s0>Kupfer</s0><s2>NC</s2><s5>22</s5></fC03><fC03 i1="14" i2="X" l="SPA"><s0>Cobre</s0><s2>NC</s2><s5>22</s5></fC03><fC03 i1="15" i2="X" l="FRE"><s0>Oxyde d'indium</s0><s5>23</s5></fC03><fC03 i1="15" i2="X" l="ENG"><s0>Indium oxide</s0><s5>23</s5></fC03><fC03 i1="15" i2="X" l="GER"><s0>Indiumoxid</s0><s5>23</s5></fC03><fC03 i1="15" i2="X" l="SPA"><s0>Indio óxido</s0><s5>23</s5></fC03><fC03 i1="16" i2="X" l="FRE"><s0>Matériau revêtu</s0><s5>24</s5></fC03><fC03 i1="16" i2="X" l="ENG"><s0>Coated material</s0><s5>24</s5></fC03><fC03 i1="16" i2="X" l="GER"><s0>Beschichteter Werkstoff</s0><s5>24</s5></fC03><fC03 i1="16" i2="X" l="SPA"><s0>Material revestido</s0><s5>24</s5></fC03><fC03 i1="17" i2="X" l="FRE"><s0>Verre</s0><s5>25</s5></fC03><fC03 i1="17" i2="X" l="ENG"><s0>Glass</s0><s5>25</s5></fC03><fC03 i1="17" i2="X" l="GER"><s0>Glas</s0><s5>25</s5></fC03><fC03 i1="17" i2="X" l="SPA"><s0>Vidrio</s0><s5>25</s5></fC03><fC03 i1="18" i2="3" l="FRE"><s0>Réseau cubique centré</s0><s5>26</s5></fC03><fC03 i1="18" i2="3" l="ENG"><s0>BCC lattices</s0><s5>26</s5></fC03><fC03 i1="19" i2="X" l="FRE"><s0>Matériau cristallin</s0><s5>27</s5></fC03><fC03 i1="19" i2="X" l="ENG"><s0>Crystalline material</s0><s5>27</s5></fC03><fC03 i1="19" i2="X" l="SPA"><s0>Material cristalino</s0><s5>27</s5></fC03><fC03 i1="20" i2="X" l="FRE"><s0>Couche contrainte</s0><s5>28</s5></fC03><fC03 i1="20" i2="X" l="ENG"><s0>Strained layer</s0><s5>28</s5></fC03><fC03 i1="20" i2="X" l="SPA"><s0>Capa forzada</s0><s5>28</s5></fC03><fC03 i1="21" i2="X" l="FRE"><s0>Fabrication microélectronique</s0><s5>46</s5></fC03><fC03 i1="21" i2="X" l="ENG"><s0>Microelectronic fabrication</s0><s5>46</s5></fC03><fC03 i1="21" i2="X" l="SPA"><s0>Fabricación microeléctrica</s0><s5>46</s5></fC03><fC03 i1="22" i2="3" l="FRE"><s0>Matériau dopé</s0><s5>47</s5></fC03><fC03 i1="22" i2="3" l="ENG"><s0>Doped materials</s0><s5>47</s5></fC03><fC03 i1="23" i2="3" l="FRE"><s0>Assemblage circuit intégré</s0><s5>48</s5></fC03><fC03 i1="23" i2="3" l="ENG"><s0>Integrated circuit bonding</s0><s5>48</s5></fC03><fC03 i1="24" i2="X" l="FRE"><s0>8105K</s0><s4>INC</s4><s5>56</s5></fC03><fC03 i1="25" i2="X" l="FRE"><s0>0779</s0><s4>INC</s4><s5>57</s5></fC03><fC03 i1="26" i2="X" l="FRE"><s0>8540H</s0><s4>INC</s4><s5>58</s5></fC03><fC03 i1="27" i2="X" l="FRE"><s0>ITO</s0><s4>INC</s4><s5>82</s5></fC03><fN21><s1>238</s1></fN21><fN44 i1="01"><s1>OTO</s1></fN44><fN82><s1>OTO</s1></fN82></pA></standard></inist></record>Pour manipuler ce document sous Unix (Dilib)
EXPLOR_STEP=IndiumV3/Data/Main/Repository
HfdSelect -h $EXPLOR_STEP/biblio.hfd -nk 000648 | SxmlIndent | more
Ou
HfdSelect -h $EXPLOR_AREA/Data/Main/Repository/biblio.hfd -nk 000648 | SxmlIndent | more
Pour mettre un lien sur cette page dans le réseau Wicri
{{Explor lien
|wiki= *** parameter Area/wikiCode missing ***
|area= IndiumV3
|flux= Main
|étape= Repository
|type= RBID
|clé= Pascal:13-0248479
|texte= Properties of electrodeposited Fe-Cu films grown on ITO coated glass substrates at different electrolyte temperatures
}}
| This area was generated with Dilib version V0.5.77. |  |